Senior IC Packaging Engineer

Requirements

• BSc or equivalent experience in Materials engineering / Mechanical Engineering/ Physics or similar.
• At least 5 years of experience in the semiconductor industry, focusing on package development and manufacturing.
• Knowledge of mechanical CAD software (Solidworks, Spaceclaim).
• Experience with development of mechanical FEA simulations using Ansys software.
• Curious and creative problem solver, well organized and multi-tasker.
• Team oriented, able to move and motivate peers, strong interpersonal skills (verbal and written).
• High awareness for quality, robustness, and manufacturability.
• High self-learning and self-motivation skills.
• Leadership skills, capability to lead cross-company projects that involve cross functional teams in Israel & abroad.

Nice to Haves

• Familiar with manufacturing environment and manufacturing statistics tool (for example – JMP).
• Background in semiconductor manufacturing processes.
• Excellent social skills.

What You'll Be Doing

• Leading development of cutting-edge microelectronics packaging of Nvidia Networking Business Unit’s future products.
• Work with world-leading vendors to develop highly challenging packaging solutions.
• Lead packaging and manufacturing-related activities and projects, from R&D to production.
• Work in a dynamic and challenging environment.
• Join and lead task forces to investigate and support production excursions, failure analysis, and reliability issues.