Principal Optical Packaging Engineer

Requirements

• Master’s or PhD’s degree in Electrical Engineering, Photonics, Materials Science, or related field
• Proven industry experience in wafer/panel level and advanced packaging with a focus on optical packaging, Co-packaged optics (CPO)
• Hands-on experience with:
  • Optical module or CPO packaging design
  • Fiber attach / optical coupling techniques
  • High-speed interconnect packaging and signal integrity considerations
• Strong understanding of system-level trade-offs (electrical, optical, thermal, mechanical)
• Ability to operate effectively in a multi-disciplinary environment
• Excellent communication skills in English, both written and spoken

Nice to Haves

• Experience in advanced semiconductor packaging (e.g., FCBGA, 2.5D/3D integration)
• Familiarity with hyperscale data center interconnect requirements
• Experience working with external manufacturing partners or Tier-1 suppliers
• Track record of delivering packaging solutions from concept to prototype or production
• Background aligned with leading CPO practitioners

What You'll Be Doing

• CPO Architecture & Packaging Co-Design
• Advanced Packaging Development
• Optical Assembly & Alignment Strategy
• Cross-Disciplinary Co-Design
• Partner Engagement & Technology Transfer
• Prototyping, Validation & Iteration

Perks and Benefits

• Shape the future of optical I/O for AI infrastructure
• Work at the intersection of photonics, electronics, and advanced packaging
• Collaborate with leading experts across Microsoft and industry
• Translate cutting-edge research into real-world deployment
• Influence both long-term innovation and near-term product directions