Senior Optical Packaging Engineer

Requirements

• Master’s or PhD’s degree in Electrical Engineering, Photonics, Materials Science, or related field
• Proven industry experience in wafer/panel level and advanced packaging with a focus on optical packaging or related technologies
• Hands-on experience with optical module or CPO packaging design, fiber attach/optical coupling techniques, high-speed interconnect packaging, and system-level trade-offs
• Ability to operate effectively in a multi-disciplinary environment
• Excellent communication skills in English

Nice to Haves

• Experience in advanced semiconductor packaging
• Familiarity with hyperscale data center interconnect requirements
• Experience working with external manufacturing partners or Tier-1 suppliers
• Track record of delivering packaging solutions from concept to prototype or production
• Background aligned with leading CPO practitioners

What You'll Be Doing

• Designing and developing packaging architectures for co-packaged optics
• Defining and prototyping packaging solutions using advanced technologies
• Developing scalable optical assembly processes and alignment strategies
• Co-optimizing packaging with photonics, electronics, and system teams
• Collaborating with partners to drive technology towards production readiness
• Building and evaluating prototypes, iterating designs based on data

Perks and Benefits

• Base pay range of £73,800.00 - £121,300.00 per year in the United Kingdom
• Eligibility for additional benefits and compensation
• Equal opportunity employer fostering diversity and inclusion
• Opportunity to work with cutting-edge technologies and collaborate with world-class researchers